I am happy to tell you that we now have a neat little case for the Parallella board thanks to the outstanding work of Alex Paloranta!
In the past the task of properly cooling the board was left up to the user. For some of you this was fine, but for many of you this was a showstopper. The goal of the new case design is to make the heating problem go away once and for all. Honestly, I am kicking myself for not making this happen earlier!
Based on initial thermal testing, it does look we have solved the problem. I used the case to showcase the FPGA accelerator project at Argonne National Laboratory a few weeks back and I can tell you that it makes a world of difference.
There are 5,000 cases on their way from China. Hopefully we can have them on the shelves in about 8 weeks.
For those of your who can’t wait and have access to a machine shop, the case sources are available HERE.